The proposals have been approved under the India Semiconductor Mission, which has an outlay of `76,000 cr

PTI New Delhi

The Union Cabinet has approved four semiconductor projects, entailing a total investment of Rs 4,594 crore, for Odisha, Punjab and Andhra Pradesh, Information & Broadcasting Minister Ashwini Vaishnaw said on Tuesday.

The proposals have been approved under the India Semiconductor Mission, which has an outlay of Rs 76,000 crore to provide financial support for setting up chip manufacturing facilities in the country. "Cabinet has approved four semiconductor plants that will be set up in Odisha, Punjab and Andhra Pradesh," Vaishnaw said.

The minister said that a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem Pvt Ltd. "Silicon carbide is a very robust material and can sustain at high temperatures. Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc," Vaishnaw said.

The minister said that the plant will have a capacity to produce 9.6 crore chips per year.

The Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions Pvt Ltd with an annual production capacity of 5 crore units.